THE ULTRA NANO-GRAIN "TECHNICAL ADVANTAGES"



SUNNBALL ULTRA NANO-GRAIN COPPER ANODE shows outstanding performance in the highly demanding plating applications. It has the perfect surface and the best grain structure with extremely uniform distribution of phosphorus. The copper crystal structure of SUNNBALL Anodes consists of ULTRA NANO-GRAINS. As a result of MPCA technology, both grain size and shape are the same in the entire batch of anodes. Ultra Nano-grains copper dissolve evenly and guarantee a stable anode film on the ball surface. Super fine grain size also ensures better anode film adhesion and thus less anode sludge creation and less consumption of organic plating additives.



NORMAL ANODE   VS   SUNNBALL ANODE


COMPARISON OF SURFACE



COMPARISON OF STRUCTURE



PRACTICAL APPLICATIONS - LABORATORY EXPERIMENTS



PRACTICAL APPLICATIONS - ACTUAL EFFECT ON PRODUCTION SITE



COMPARISON OF MEMBRANE QUALITY ON PRODUCTION LINE



PRACTICAL APPLICATIONS - ACTUAL EFFECT ON PRODUCTION SITE



Low Phosphorus & Even Distribution

In terms of the Phosphorus content, the Sunnball Ultra Nano-Grain Anodes has lower than the normal one. That is because the phosphorus distribute evenly in grain structure and can release the copper ion stably, so the lower phosphorus is required. What is more, low phosphorus also meet the environment requirements. It is also one characteristics of Nano-Grain Copper Anodes.


More Copper Per Ball

SUNNBALL COPPER ANODES weigh upto 7.50-20% more than the same diameters balls of other brands. MPCA technology compresses the anode & reforms it's entire grain structure and is very good in prevention of porous erosion of the ball and to avoid nodular plating caused by undissolved copper dust in the plating tank.


Low Optimum Consumption Of Copper Anodes

According to laboratory experiments, using NANO-GRAIN copper Anode can save 3-5% Copper anode for every ton. The Copper content in the plating is stable – meaning most optimum consumption of copper


Low Iron Content

Normal standard for Fe (Iron) is 30ppm and most mills supply Iron content between 10-30ppm. Our Internal standard is much tighter and we try to keep it at less than 10ppm


Low Other Impurities

Tin, lead and silver form sludge that floats in the bath causing inclusions and a rough finish to the coating. Antimony and bismuth will reduce the mechanical stress capability. Inhomogeneous casting structures with oxides and pores can decrease formability and therefore the quality of the end product.


Low Sludge Generation

Impurities like iron, nickel, zinc and arsenic tend to dissolve in the plating bath and get enriched as time goes by. If the impurity level is high enough, elements start to interfere with the plating process by precipitating on the coating. This leads to lower electrical conductivity, stresses and changing mechanical properties of the coating. Impurities can reduce the physical properties such as ductility.


Time Savings – Higher Productivity

The build-up of the adherent anode's film is rapid and strong that allows a problem-free start-up of the new bath with Phosphorised Copper Anodes

Due to low sludge formation you can double the time gap between changing container & cleaning the tanks / titanium baskets


Extra Annual Discounts & Rebates For Signing Annual Contracts

Most buyers are loyal to us & buy regularly from us – we value their loyalty & trust and in return offer them Annual discounts & rebates based on their volumes – IF THEY SIGN ANNUAL CONTRACTS WITH US. This discount is over & above our normally highly competitive price.


Best Hedging Partners

We offer hedging & forward booking contracts upto 6 months ahead